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1. Principle of the Nanometer Dry Ice Semiconductor Cleaning Equipment

Using granular dry ice as the cleaning medium, the dry ice particles are sprayed at high speed onto the surface of the object to be cleaned through compressed air. This freezes the dirt on the surface of the object to be cleaned until it becomes brittle and bursts. The dry ice particles penetrate between the dirt and the base material through the impact force and then sublimate immediately. The volume instantaneously increases by 800 times, forcing the dirt to separate from the base material, thus achieving the purpose of cleaning.

2.Parameters of the Nanometer Dry Ice Semiconductor Cleaning Equipment

Model: Optical Component Cleaning Machine WMGB02

Overall Dimensions: 500×900×1200

Weight: 60Kg

Power Supply: AC220V 50Hz Single Phase

Power: 3.5kW

CO2 Spraying System

CO2 State: Gaseous/Liquid

CO2 Pressure: ≥1MPa

Nozzle Specification: 0.1mm~4mm

CO2 Consumption: 50~200g/min

CO2 Constant Temperature System

Medium: Water/Refrigerant

Capacity: 4L

Temperature Adjustment Range: Room Temperature~10℃

CO2 Pressure Boosting System

Driving Medium: Compressed Air

Driving Air Pressure: 0.1~0.8MPa

Pressure Boosting Ratio: 1:15

Pressure Boosting Quantity: 320L/min

CDA Auxiliary System

CDA Gas: Compressed Air/Nitrogen

CDA Pressure: 0.1~0.8MPa

CDA Temperature Adjustment: Standard Configuration