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Last Online:05 May, 2025 |
1.Principle of the Nanometer Dry Ice Semiconductor Cleaning Equipment
Using granular dry ice as the cleaning medium, the dry ice particles are sprayed at high speed onto the surface of the object to be cleaned through compressed air. This freezes the dirt on the surface of the object to be cleaned until it becomes brittle and bursts. The dry ice particles penetrate between the dirt and the base material through the impact force and then sublimate immediately. The volume instantaneously increases by 800 times, forcing the dirt to separate from the base material, thus achieving the purpose of cleaning.
2.Parameters of the Nanometer Dry Ice Semiconductor Cleaning Equipment
Model: Semiconductor Cleaning Machine WMGB01
Overall Dimensions: 450×500×300
Weight: 20Kg
Power Supply: 220V 50Hz Single Phase
Power: 2kW
CO2 Spraying System
CO2 State: Liquid
CO2 Pressure: ≥5.5MPa
Nozzle Specification: 0.1mm~4mm
CO2 Consumption: 50~200g/min
CO2 Constant Temperature System
Medium: -
Capacity: -
Temperature Adjustment Range: -
CO2 Pressure Boosting System
Driving Medium: -
Driving Air Pressure: -
Pressure Boosting Ratio: -
Pressure Boosting Quantity: -
CDA Auxiliary System
CDA Gas: Compressed Air/Nitrogen
CDA Pressure: 0.1~0.8MPa
CDA Temperature Adjustment: Optional