J26-T1 (24") Pulse Heat Bonding Machine
Product Description
Features: |
| System auto-check feature checks all the units, displays and alert in advance. |
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| All the mechanical action analyzed and executed by software which is suitable for machine pre-set and manual operation. |
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| Password setting and change available, emphasizes the product data secrecy and centralize the management of the equipment. |
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| System auto-check and adjusts the temperature. |
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| Temperature rise time can be controlled by speed adjustment and reduce cycle time and improve throughput. |
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| Parameters such as Steps of temperature, temperature, and time can be displayed by curve or numbers. |
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| State of all the units and failure alert displayed on the Operating Interface. |
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| Double switch and emergency stop switch both guarantee production safety. |
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| IC position profiles can be memorized automatically and can be retrieved. |
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| Storage and edition up to 20 groups of profile can be retrieved directly next time without setting again. |
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Specification: |
Control System | LG-K7M-DR-PLC | Operating Interface | WEIVEW Full-Color PDA | Pressure Range | 1-28.2kgf | Time Range | 1-100s | Throughput | 180-240PCS/H | Bond Head Accuracy | ± 0.01mm | Temperature Range | RT-500 Degree Celsius | Product Min Pitch | pitch≥ 0.01mm | Product Max Size | 24 inches | Alignment Min Width | 10mm | CCD Magnification | 120-240 X | Temperature steps | 6(including start / away temperature) | Temperature rise time/step | 1-2 s/step | Power | 2-3KW | Thermocouple | K Type | Weight | 200KG | Dimension | (L) 1060mm × (W) 730mm × (H) 1450mm |
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