J63-B2 Constant Heat Bonding Machine
Product Description
Features: |
| Constant temperature heating, In-Out feeding. |
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| Double layers enhanced insulation. Accurate temperature control sensing. |
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| Vacuum system installed, precise time control, high accuracy horizontal adjust, ensures production quality. |
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| 2 sets CCD alignment system ensures alignment accuracy. |
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| Suitable for all kinds of interconnection bonding between LCD, HSC and PCB, TAB, TCP . |
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Specification: |
Control System | Panasonic PLC | Operating Interface | Manual / Automatic operation can switch alternatively | Time Range | 1S-999H | Throughput | 180-250PCS/H | Bond Head Accuracy | ± 0.01mm | Temperature Range | RT-399 Degree Celsius | Pressure Range | 16.6-44kgf | Product Min Pitch | pitch ≥ 0.1mm | Product Max Size | 7 inches diagonal | Alignment Min Width | 10mm | CCD Magnification | 40-100 X | Power | 0.3KW | Thermocouple | K Type | Weight | 45KG | Dimension | (L) 650mm × (W) 545mm × (H) 660mm |
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