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Pulse heating. Rotary platform enhance throughput.

Imported temperature control system enhance accuracy, Accuracy< ± 2 ℃ . Temperature rising curve and parameter display synchronously.

High rigidness titanium alloy bond head ensures quality. Can maintain evenness under heavy duty from high temperature.

5.7 inches diagonal intelligent ergonomic interface. PLC enables the consistency and reliability of the entire equipment.

2 sets CCD alignment system. A lignment clear and accurate.

Ergonomic design of adjustable left-right table, convenient for production, saves cost and space.

Automatic temperature compensation feature increase accuracy of temperature.

Large memory for program storage, multifunctional operation menu helps the operation and preset more easy and convenient.

Suitable for all kinds of TAB, TCP bonding and FPC, FFC, PCB soldering or solder bonding.

Control System

LG-K 7M -DR-PLC

Operating Interface

WEIVEW Full-Color PDA

Pressure Range

1-28.4kgf

Time Range

1-100s

Throughput

400-450PCS/H

Bond Head Accuracy

± 0.01mm

Temperature Accuracy

± 2 Degree Celsius

Product Min Pitch

pitch ≥ 0.01mm

Product Max Size

7 inches diagonal

Alignment Min Width

10mm

CCD Magnification

70-120 X

Temperature steps

6(including start / away temperature)

Temperature rise time/step

1-2 s/step

Power

2-3KW

Thermocouple

K Type

Weight

125KG

Dimension

(L) 740mm × (W) 720mm × (H) 1480mm