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Pulse and Constant heating available, high speed temperature rise/drop and auxiliary cooling system. Can store up to 15 programmable profiles, 6 steps of setting available.

High magnification coaxial optical alignment system ensures the accuracy of product alignment.

Adopts imported temperature control system, fast heating. Accurate temperature control. Temperature rising curve and parameter display synchronously.

High quality titanium alloy bond head , automatic temperature compensation feature increase accuracy of temperature.

High accuracy imported screw adopted in the platform x axis, slider positioning synchronously. PLC set and save the IC position automatically according to the production requirement.

Full color ergonomic touch panel interface helps operation more convenient and visual.

Suitable for all kinds of bonding between TAB, FPC and PCB in 12-24 inches TFT.

Control System

LG-K7M-DR-PLC

Operating Interface

WEIVEW Full-Color PDA

Pressure Range

1-28.2kgf

Time Range

1-100s

Throughput

180-240PCS/H

Bond Head Accuracy

± 0.01mm

Temperature Range

RT-500 Degree Celsius

Product Min Pitch

pitch≥ 0.01mm

Product Max Size

32 inches

Alignment Min Width

10um

CCD Magnification

120-240 X

Temperature steps

6(including start / away temperature)

Temperature rise time/step

1-2 s/step

Power

2-3KW

Thermocouple

K Type

Weight

250KG

Dimension

(L) 1220mm × (W) 1200mm × (H) 1601mm