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BERGQUIST SP900S, SIL PAD TSP 1600S,SIL PAD 900S

High Performance Insulator for Low-Pressure Applications

BERGQUIST SIL PAD 900S Features and Benefits
• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution

The true workhorse of the SIL PAD product family, BERGQUIST  SIL PAD 900S thermally conductive
insulation material is designed for a  wide variety of applications requiring high thermal performance and electrical
isolation. These applications also typically  have low mounting pressures for component clamping.
BERGQUIST  SIL PAD  TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal  conductivity. These features optimize the thermal resistance properties at low pressures.
Applications requiring low component  clamping forces include discret  esemiconductors (TO-220, TO-247 and
TO-218) mounted with spring clips .Spring clips assist with quick assembly  and apply a limited amount of force
to the semiconductor. The smooth  surface texture of BERGQUIST  SP900S minimizes interfacial thermal
resistance and maximizes thermal  performance.

Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive