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Bergquist  HF300P,HI-FLOW THF 1600P,HI-FLOW 300P

Bergquist  HF300P Features and Benefits
• Thermal impedance: 0.13°C-in. 2 /W
(at 25 psi)
• Field-proven polyimide film; excellent
dielectric performance; excellent cut-
through resistance
• Outstanding thermal performance in an
insulated pad

BERGQUIST  HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally  conductive polyimide film. The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems.
BERGQUIST  HI-FLOW 300P  achieves outstanding values in voltage breakdown and thermal performance. The
product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. BERGQUIST 
HI-FLOW 300P is designed for use as a thermal interface material between electronic power devices requiring
electrical isolation to the heat sink.

BERGQUIST HF300P Typical Applications Include:
• Spring or clip-mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts and sheet form, dry both sides