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The LG series high performance, thermal conductive pad designed with extremely high thermal

conductivity and fitting performance, which is from the boron nitride powder of the raw material

compound, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

features & benefits:

• High compressibility, soft and flexible, designed for applications in low-stress application environment
• Nice thermal conductivity
• Electrical insulation
• Meet with the environmental requirements of ROHS and UL
• Natural stickiness

Typical applications:

• Laptop
• Communication hardware equipment
• High-speed hard disk drive equipment
• Automobile engine control mould
• Micro processor, memory chip and graphics processor
• Mobile equipment

Physical properties:

Configurations available: 200mm*400mm, 300mm*300mm; Customized size available

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