Home > Products > Industrial Supplies > Electrical & Electronic Product Equipment

TheAW-105R  single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.

 AW-105R  Applications:

        GaAs, InP, GaN, SiC wafer Strip (Mainly)

        GaAs, InP, GaN, SiC wafer Descum (Mainly)

        Thin Film Head Resist Cleaning

        Opto-Electronic Devices Cleaning

        Photoresist Stripping

        High dose implant (As+, B+, P+)           

        Rework

        Post-polysilicon 

        Controlled Resist Removal

        Post-develop descum

        Uniformity capability (<5% 1σ)

 AW-105R  Key Features:

        Production-proven plasma Asher/Descum system.

        Integrated solid robotic wafer handling, Single wafer process.

        Up to 3%-5% Uniformity. Best for III-V Materials.

        Frontside and backside isotropic removal.

        Consistent wafer-to-wafer process cycle repeatability.

        Element heating for up to 250oC.

        50mm-150mm wafer capability. Up to 6.25” substrate.

        Up to 4 wafer size capability without hardware change.

        Fixed cassette station and wafer aligner/cooling station.

        Can handle 50um thickness wafer.

        PC controller with Advanced Allwin21 Software.

        Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional).

        Up to 3 gas lines with MFC.

        Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option).

        Pressure control with Throttle Valve.

        15-inch Touch screen monitor GUI.

        EMO, Interlocks, and Watchdog function.

        GEM/SECS II (optional).

        Small Footprint: 27”W x 40”D x 59”H   (280LBs)

        Made in U.S.A.

 AW-105R  Software Key Features:

        Real time graphics display, process data acquisition, and analysis.

        Closed-loop process parameters control.

        Precise parameters profiles tailored to suit specific process requirements.

        Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.

        Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.

        Validation of the recipe so improper control sequences will be revealed.

        Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.

        Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.

        Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.

        Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”.

        DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.

        The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.

        GEM/SECS II function (Optional).

        Advanced Allwin21 End of Process (EOP) function (Optional)

 AW-105R  Specifications:

        Wafer Size: Up to 6.25 inch.

        Temperature: 60-250ºC (±2ºC)

        Gas Lines: Up to three gas lines with MFCs.Typical MFC configuration: 5 SLM O2 and 500 SCCM N2.

        Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum

        Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum

        Particulate: <0.05 /cm2 (0.03um or greater)

        Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no shift >5%

        Selectivity: >1000:1

        MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.

        95% uptime

        *Contact Allwin21 sales for other applications and specifications

 AW-105R  Configuration:

        Main Frame with Circuit Breakers, Solenoid Valves

        Pentium Class PC with AW Software

        Keyboard, Mouse, USB SW backup, and Cables

        Chuck /w Heat, Pump Ring ,Lift Pins

① 2-4 inch;  ② 2-6 inch; ③ 4-6 inch; ④ 6.125 inch; ⑤ 6.25 inch

        Center Aligner and Cassette Station

• ① Two Dimensions    ② Four Dimensions

        Anodized Reactor with Door

        Chamber Base plate with water sensor

        Base Plate and Reactor Ceramic Ring

        Base Plate and Chuck Ceramic Ring

        Upper and Lower Electrodes

        Quartz showerhead & Diffusion Disk

        Main Control and Distribution PCBs

        3-axis Integrated Robust Solid Robot

        RF Matching Network with PCBs

        13.56MHz RF Generator

• ① 300W    ② 600W

        MFC /w In-line Filter and Solenoid Isolation Valve

• ① One MFC;  ② Two MFCs;  ③ Three MFCs

        AC/DC Box with Temperature Controller

        MKS Baratron with Isolation Valve

        Lamp Tower Alarm w/ Buzzer

        Throttle Valve

        Main Vacuum Valve

        Front EMO, Interlocks

        15-inch Touch Screen GUI

 AW-105R  Options:

        End-of-Process (EOP)

        GEM/SECS II (Software)

        Vacuum Pump

        Chiller for Chamber Base Plate

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10