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The AW-B3000  batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership.

AW-B3000  Applications:

        Low cost production-proven plasma Asher / Descum

        Front and backside isotropic photoresist removal.

        Barrel/Batch Manual Load Process

        Descum

AW-B3000  Key Features:

        Production-proven plasma Stripper/Asher/Descum technology.

        Up to 25% Uniformity. Much lower if used with a Faraday Cage.

        Consistent wafer-to-wafer uniformity.

        TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.

        End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness.

        Samples, 6” square, and up to 8” round wafers capable.

        Many wafer sizes capability without hardware change.

        Can handle different thickness wafer with different carriers.

        New controller with PC with Advanced AW Software

        Up to 5 isolated gas lines with MFC’s

        13.56 MHz RF Generator.  (Air-cooled Optional)

        Pressure Control Throttle Valve for better process repeatability.  (Optional)

        MKS Baratron (Optional)

        Touch screen GUI

        EMO, Interlocks and Watchdog function

        GEM/SECS II (Optional)

        Made in U.S.A.

AW-B3000 Software Key Features:

        Real time graphics display (GUI), process data acquisition, display, and analysis.

        Closed-loop process parameters control.

        Precise parameters profiles tailored to suit specific process requirements. 

        Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.

        Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.

        Validation of the recipe so improper control sequences will be revealed.

        Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.

        Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions

        Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.

        Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.

        DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.

        The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.

        GEM/SEC II function (Optional).

        Advanced Allwin21 EOP function (Optional)

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AW-B3000  Specifications:

        Wafer Size: Sample to 200mm Capability.  Multiple wafer size without hardware change

        High Throughput: Up to 75 WPH. Process Dependent.

        Temperature: Only TC Option can be used for N2 plasma to heat the substrates up to 170°C.

        Gas Lines: Up to 5 isolated gas lines with MFCs.

        Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR.  Slower if Faraday Cage is used

        Uniformity: Up to 25%. Much lower with Faraday Cage.

        Particulate: <0.05 /cm2 (0.03um or greater)

        Damage: Low damage with Faraday Cage.

        Selectivity: >1000:1

        MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.

        95% uptime

        Contact Allwin21 sales for other applications and specifications

AW-B3000  Configuration:

        Main Body with wires

        Control Box

        Pentium Class PC with AW Software

        Keyboard, Mouse, USB with SW backup and Cables

        Main Control PCB and DC

        Transformer, Circuit Breaker,Contactor

        1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC

        Purge has manual regulator in controller box to control speed.

        Quartz Chamber: Dia 12” x Depth 23”;

        RF Match Network Integrated in the Main Body of tool.

        Chamber Door with quartz plate in the Main Body.

        Gas and vacuum lines Connections in the Main Body

        13.56MHz RF Generator (Air-Cooled is Optional)

• ① 300W;  ② 600W;  ③ 1000W;  ④ 1200W

        Lamp tower alarm with buzzer

        Main Vacuum Valve

        MKS Baratron

        Throttle Valve

        Front EMO, Interlocks

        15-inch Touch Screen GUI

AW-B3000  Options:

        End-of-Process (EOP) function.

        Throttle Valve for pressure control.

        Air-cooled RF Generator.

        GEM/SECS II function (Software)

        Thermocouple for Chamber Temperature

        Vacuum Pump

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher