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Quick Details

Type:High Power LED

Chip Material:InGaN

Emitting Color:Cool White

Luminous Flux(lm):1120 lm

Power:19W

Viewing Angle(°):120 deg

Color Rendering Index(Ra):68

Color Temperature:5700K

Place of Origin:United States

Brand Name:Cree

Certification:CE, RoHS

Product:White LEDs

Voltage:6V 12 V

Current:5.75 V White  1400 mA (6 V) 11.5 V White  700 mA (12 V)

CCT:5700KLength:5 mm

width:5 mm

Max Light Output (lm):2546 lm

lumination Color:white

Brand:Cree

Powered by Cree’s groundbreaking SC5 Technolog Platform, the XLamp XHP50 LED is a member of Cree's Extreme High Power (XHP) class of LEDs that redefines lumen density and reliability to radically reduce system costs by up to 40 percent. At its maximum current, the XHP50 LED delivers twice the light output of the industry’s brightest single-die LED, the XLamp XM-L2 LED, at a similar lumens per watt and without increasing the package footprint. The XHP50 LED also achieves longer lifetime at higher operating temperatures. The overall result is significantly lower thermal, mechanical and optical costs at the system level.

FEATURES 

Available in white, configurable to 6 V or 12 V by PCB layout 

Available in 5 step EasyWhite bins at 3000 K to 5000 K CCT, 3 step EasyWhite bins at 2700 K to 5000 K and 2-step EasyWhite bins at 2700 K to 4000 K CCT

Available in ANSI white bins at 3000 K to 7000 K CCT

Available in standard, 70, 80, and 90 minimum CRI options

Binned at 85 °C

Maximum drive current: 3000 mA (6 V), 1500 mA (12 V)

Low thermal resistance: 1.2 °C/W

Wide viewing angle: 120°

Unlimited floor life at ≤ 30 ºC/85% RH

Reflow solderable JEDEC J STD 020C 

RoHS and REACh compliant

UL recognized component (E349212)

Specification:

Size: 5 x 5 mm
Product Options: 6 V 12 V
High CRI
Maximum Drive Current (Standard) :3 A (6 V)/1.5 A (12 V)
Max Power :(W) 19 W
Max Light Output (lm) :2546 lm
Maximum Efficacy at Binning Conditions (lm/W):149 lm/W
Typical Forward Voltage: 5.75 V White  1400 mA (6 V) / 11.5 V White  700 mA (12 V)
Maximum Reverse Voltage: Under 5 V
Viewing Angle: 120 °
Maximum Junction Temperature:150 °C
Binning: 85°C
ANSI (White)
2- 3- and 5-Step EasyWhite
Maximum ESD Withstand Voltage: 8000 V (HBM per Mil-Std-883D)
Reflow Solderable: Yes  JEDEC J STD 020C compatible
RoHS Compliant: Yes
REACh Compliant: Yes
UL Recognized:Yes  Level 4 Enclosure Consideration