Model: | XPEBWT-01-0000- |
---|---|
Brand: | Cree |
Origin: | Made In United States |
Category: | Electronics & Electricity / Other Electrical & Electronic |
Label: | Cree led , 3W led |
Price: |
US $0.59
/ pc
|
Min. Order: | 1000 pc |
Live Chat: | Last Online:06 Mar, 2019 |
Quick Details
Type:High Power LED
Chip Material:InGaN
Emitting Color:Cool White
Luminous Flux(lm):283 lm
Power:1-3W
Viewing Angle(°):110deg
Color Rendering Index(Ra):70
Color Temperature:4300K
Place of Origin:United States
Brand Name:Cree
Certification:CE, RoHSP
roduct:White LEDs
Voltage:2.9V
Current:350m A
CCT:4300K
Length:3.45 mm
width:3.45 mm
Max Light Output (lm):283 lm
Color:neutral white
Chip brand:Cree
The XLamp® XPE2 LED builds on the unprecedented performance of the original XPE by increasing lumen output up to 20% while providing a single die LED point source for precise optical control. The XPE2 LED shares the same footprint as the original XPE, providing a seamless upgrade path to more lumens and/or greater efficiency while shortening the design cycle for existing XP customers. XLamp XPE2 LEDs are the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED retrofit lamps, outdoor, portable, indoor directional, emergency vehicle or architectural
Features: Available in white, outdoor white, 80CRI, 85CRI, 90CRI
white, royal blue, blue, green, PC amber, amber, red orange& red
ANSI compatible chromaticity bins
White binned at 85 °C
Maximum drive current: 1 A
Low thermal resistance: as low as 5 °C/W
Wide viewing angle: 110°135°
Unlimited floor life at ≤ 30 °C/85%
RH Reflow solderable JEDEC J STD 020C compatible
Electrically neutral thermal path
RoHS and REACh compliant
UL® recognized component (E349212)
Specification:
Size:3.45 x 3.45 mm
Product Options:White Color
Maximum Drive Current (Standard):1 A Max
Power (W):3 W
Max Light Output (lm):283 lm
Maximum Efficacy at Binning Conditions (lm/W):137 lm/W
Typical Forward Voltage:2.9 V White 350 mA
Maximum Reverse Voltage :5 V
Viewing Angle:110 Maximum
Junction Temperature:150 °C Binning 85°C ANSI Maximum ESD Withstand Voltage:8000 V (HBM per Mil Std 883D) ESD Classification:Class 2(HBM per Mil Std 883D) Reflow
Solderable:Yes
JEDEC J STD 020C compatible
RoHS Compliant:Yes
REACh Compliant:Yes
UL Recognized:Yes Level 4 Enclosure Consideration