main focus on semiconductor manufacturing area including front-end, and back-end. main biz including: 1) OEM spare parts covering back-end whole  IC manufacturing process machine wafer mount, wafer saw, die attach, wire bonding, molding, plating and testing & packing.

2) Tools: sawing blade, bonding tools, capillary, capillary screw, wire guide, testing finger, rubber tip , nozzle, etc.

3) Indirect materials:  ESD container, clean-room smocks, clean-room clothes etc.

4) Technical Support: design & machine retrofit, motor driver maintenance, all control board maintenace etc.