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ZX-C1 soldering machine, BGA rework station

Features

1.With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;

2.Upper heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time;

3.Three temperature zone with independent PID to control heating process, more stable and accurate;

4.Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;

5. After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;

6.Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles;

7.Build-in vacuum pump, no need gas source.

Specifications

PCB size ≤L540 *W450mm
PCB Thickness 0.1~5mm
Temperature Control K Thermocouple, Closed loop
PCB Positioning Outer
Sub (Bottom) heater Infrared 2400W
Main (Top) heater Hot air 800W+800W
Power supply Single phase 220V,50/60Hz,3.4KVA
Machine dimension L700 ×W475×H520mm
Weight of machine Approx.33kgs