Vertical conductive adhesive
Product Description
Conductive adhesive composition of the silica and gold ions, gold ions by the conduction conduction, pressure does not turn from the vertical, size: 350mm * 215mm * 0.15mm;
2, the general circumstances under which the pressure is 2-5Kg / c ㎡;
3, a small conductive adhesive resistance itself, subject to the actual test board, (insulation resistance of 1M-20M ohm ohm, open circuit impedance of 20 ohms or more);
4, conductive resin soft, without leaving any traces on the board;
5, the conductive adhesive spread on the surface directly to the test fixture used to play the role of conductivity;
6, the minimum test PAD, round to test more than 4mil, rectangles can be measured 2mil * 4mil above, the minimum side-to-edge spacing 3mil, minimum PITCH is 6mil;
7, mainly for high-density HDI PCB and FPC board test;
8, the board will not tie marks, there is no thickness limit, the test good rate. Test plate surface without needle marks, test yields 95% (one of the bit test can be separated from the product yield and poor) and the ability to make sensitive on-PAD size, spacing, density can reach smaller, more recent, more high test results;
9, the test life, usually in the range 10-12 million times, depending on the test fixture.
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