Metal sputtering target:
Aluminum (Al), Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (CD), Cerium (CE), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Eur (EU), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (IR), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (ND), Niobiums (Nb), Nickel (Ni), Palladium (Pd), Platinum (PT), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (AG), Tantalum (Ta), Terbium (Tb), Tellurium (Te), Tin (Sn), Thulium (TM), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
