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●Infrared waves penetate into IC interior,which causes sympatheic vibraion of atoms  and molecules to heating rapidly. Heats are transmitted to tinmelt soldering tin dismanting IC. ●High heating effect:controllable heats energy;just more than 5 minutes is enough for you to dismantle IC.●Super strong penetrability andeven radiation:Heat radiation pentrates evenly, the upside can recerience same heat energy from the same heat source, which can avoid all kinds and PCB board experience same extends of expansion and contraction. This can aviod all kinds of risk,such as the explosion caused by local over-heart of  the elementfaults in the elemnt, faults in the lines of PCB board, the distortion of the FPC board etc. Security is extremely important, especially traditional Airgun is flowingheat wind, low  heat energy,the process of heating the elements is from outside to inside, from local to the whole;meanwhile, impacts of heat energy caused by hot wind from Airgun also result in low repair efficency and the damage of parts and components. But infraed can avoid all these disadvantages easily. Theseexcellen capabilities make our products unbeatable when it dismantles waterproof solid sealing colloid around the chip.
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