DR-QG8G diamond laser cutting machine is specially designed for the diamond-cutting, it is characterized by fast cutting speed, high production efficiency and low loss, its simple software operation is efficient and time-saving. The DR-QG8G automatic ultraviolet dia
mond laser cutting machine uses ultraviolet laser with high-power of 355nm as
light source. As the ultraviolet beam’s focused spot is extremely small, it can achieve ultra-fine cutting. Ultraviolet laser processing is a kind of "cold processing", in which the "cold" cutting leads to few place be affected by heat. At the same time, during the non-contact processing manner, there produces no stress in the crystal grain, so the production yield of crystal grain cut is high, and the parameters of electrical performance is much better than mechanical cutting. The High-precision, automatic system configuration make it better than mechanical cutting methods in cutting speed, material utilization, cost and so on.
This device has the following features: Ultraviolet laser machine with high power of 355nm; high precision two-dimensional platform; high-precision rotating platform; automatic delivery and discharge device; high precision CCD imaging control system; gas cooling system, which is more convenient than water cooling method in mechanical cutting , and low usage cost.
Good quality of Laser beam, small focus spot, narrow cutting gap, high processing speed, small heat affected zone; flat and smooth cutting gap, no cracks, high yield rate, high productivity, close cutting gap, high utilization of silicon area; automatic delivery and discharge, automatic image processing, without manual operation; high cutting speed, efficiency and precision; non-contact processing, without supplies, low cost of usage and maintenance. The whole process is controlled by computer software, which is easy to operate, and it can give the feedback of abnormal signals. The performance of machine is stable, and can be used for a long time.
Applicable materials and industries
Mainly used for scribing and cutting of diamond, sapphire; it also applies to the scribing and fine processing of thin ceramics, silicon wafers, IC crystalline grain, the polymer films and other materials.
Specifications
Laser wavelength: 532 nm
Beam divergence angle: ≤ 2.0mrad
Cutting width: 10-30μm
Cutting depth: 10-40μm
Cutting width precision: ± 2μm
Cutting accuracy: ± 2μm
Cutting straight line accuracy: ± 5μm
Cutting straight-line speed: 0-300 mm / s
Range of processing: 300mm × 300mm
Rated input voltage: single-phase AC 220V ± 10%, 50 Hz/60Hz, with protection ground wire (such as voltage fluctuation is too large to be equipped with voltage regulator)
Maximum input power: 2 kW
Size: 1300 mm ´ 710 mm ´ 1400 mm
Cooling methods: oil-cooling
