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In the embedded power module with an aluminum sheet, select the soft silicone thermal insulation pad, and the circuit board sandwiched between the heat through the aluminum plate by a simple test chip temperature can drop ten degrees. Effective heat dissipation, do not blindly increase ventilation, can reduce equipment noise

As electronic devices continue to integrate more powerful functions to more group pieces, the temperature control has become critical to the design of one of the challenges that the tightening in the structure, operating increasingly small space, how effective is taken away larger units of power generated more heat. Designers have been working to improve all kinds of server CPU speed and processing power, which requires the microprocessor to constantly improve thermal performance. But in other applications, such as video game consoles, video equipment and the need for higher performance to support high-definition images in digital applications, but also on the demand for greater computing performance.
As a result, chip makers are more concerned than ever, thermal conductivity material (Thermally-Conductive Interface Materials, TIM) and other techniques to remove excess heat, the heat stability and life of components are counterproductive. Is well known that the operating junction temperature on the circuit (transistor) have a dramatic effect durability, slightly lower temperature (10 ℃ -15 ℃) will be able to triple the life of equipment. [1] a lower operating temperature can also shorten the signal delay, and thus help to improve processing speed. In addition, lower temperatures also reduce the device's idle power dissipation (leakage power), can reduce the total power consumption of cooling.
Soft silicone pad with good thermal insulating ability and high level of thermal pressure, is the alternative to replace the thermal grease, the material itself has a certain degree of flexibility, a good fit with the cooling power devices or machines aluminum enclosure between so as to achieve the best thermal conductivity and heat dissipation purposes, the electronics industry to meet current demands on the thermal conductivity materials, thermal paste is an alternative to thermal grease mica binary plus the best cooling system products. Any of these products can be cut, which will help to meet the automation of production and product maintenance.
Thermal insulation technology silicone pad thickness ranging from 0.5mm ~ 5mm, 0.5mm each one plus, that is 0.5mm 1mm 1.5mm 2mm ~ 5mm, special requirements may be increased to 15mm, designed for heat transfer by slot design production, to fill gaps, complete heating and cooling parts of the heat transfer area, but also play a role in shock absorption insulation seals to meet the social facilities of the small ultra-thin design is of great use of technology and new materials.
Fire retardant performance meets UL 94V-0 requirements, and compliance with EU environmental certification SGS
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