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Insulation board, epoxy board, 324 epoxy board information title: supply 324 epoxy board, insulation board, epoxy resin plates, keywords: insulation board, epoxy board, 324 epoxy board instructions: the product epoxy board: glass fiber cloth with epoxy resin glue them into increased temperature and pressure production, type, medium temperature under 324 in high mechanical properties and under high temperature electric performance is stable. Suitable for mechanical, electrical and electronic components with high insulation structure, high mechanical and dielectric good heat resistance and resistance to wet sex. Heat-resistant grade class F (155 degrees). Specification thickness: 0.5 ~ 100mm general specification: 1000mm * 2000mm colors: yellow origin: domestic materials introduction epoxy resin is tuyuhun molecule containing two or more epoxy groups of organic macromolecular, in addition to the individual outside, their relative molecular mass is not high. Epoxy resin is the molecular structure of the molecular chain contain lively epoxy groups for its characteristics, epoxy groups can be located at the end of the molecular chain, middle or into ring structures. Because of molecular structure contains lively epoxy groups, making them with multiple types of curing agent some cross-linking reactions and the formation of insoluble, don't melt with three to reticulation polymers. Application features 1, diverse forms. Various resin, curing agent, modification agent system almost to be able to adapt to each application form of the request, the range is from a very low viscosity to high melting point solid. 2, curing convenient. Choose different curing agent, epoxy resin system can be almost at 0 ~ 180 ℃ temperature range curing. 3, good adhesive. Epoxy resin molecular chain inherent in the polarity of the hydroxyl and ether keys to the existence of various substances, which has high adhesion strength. Epoxy resin curing the contractile low, produce the internal stress of small, it also helps to improve adhesion strength. 4, contractile low. Epoxy resin, curing reaction is used by direct addition reaction or resin molecules in epoxy groups open-loop polymerization, no water or other volatile by-products release. They and unsaturated polyester resin, phenolic resin, compared to the solidification process in show very low shrinkage sex (2%). 5 and mechanical properties. After curing epoxy resin system with excellent mechanical properties.