solar scribing cell machine
Product Description
Technical Specification:
Laser wavelength: 1064nm
Laser mode: semi-conductor
The maximum output power of laser: ≥50w
Laser modulation frequency: 200HZ~50KHZ (Adjustable)
The size of work : 320mm*320mm
Repeatability: 0.002mm
Positioning accuracy: 0.002mm
Marking line depth: 0.01~0.3mm (Visual material)
Using power: 220V/ 50 HZ/ 2kw
Cooling: Water/compressor cooling
Application fields:
1. Dicing mono-crystalline and poly-crystalline silicon at solar industry, of non-crystalline silicon with solar cell chip and wafer;
2. Engraving and lineation of crystal less silicon cell board at solar energy industry;
3. Cutting and lineation of silicon, germanium, gallium, arsenide semiconductor substrate materials at electronic industry.
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