Product Description
Electroplate diamond band saws are specially used for cropping and slicing the monocrystal silicon ingots.The saws are made by special technology with the stainless steel,that is most suitable for the cycle movement of saws,and the special diamond abrasives.The diameters,up to 12",of monocrystalline silicon ingots can be cropped and the thinnest wafers of 1mm can be sliced up as well.The saws can perform high speed,long duration and smooth cutting surface of wafers.
3230mm(perimeter) x 40mm(width) x0.5/0.6/ 0.7mm(thickness)
3440mm(perimeter) x 40mm(width) x0.5/0.6/ 0.7mm(thickness)
3530mm(perimeter) x 40mm(width) x0.5/0.6/ 0.7mm(thickness)
Any other specifications can be supplied according requirements
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