Two- to Four-Layer Rigid-Flex PCBs with FR4/HDI-PDA Laminate Material Key Specifications/Special Features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch FR4 New FR4 technology from photo circuit New thermally conductive adhesive technology Suitable for body through power train controller application
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