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GS-S1K-C2 II Laser 3D/2D Subsurface Engraving Machine is a new laser processing equipment that combines laser technology, computer technology and integrates optics, machiney and electronic.

It adopts pulse laser and focuses it inside transparent materials to produce nanometer points

of vaporous burst. Because the points can constitute splendid picture, pattern, and words inside glass controlled by computer, ordinary transparent materials can be made into grade luxurious art wares.

Our series laser subsurface engraving machine usually fit to glass decoration industry, crystal gift industry, glass gift industry, glass and Plexiglas signs industry. It can also be used in secondary process industry of all kinds of bottles and other transparent materials

Specification: 

Laser Medium                    Diode Pump

Cooling system                   Air cooler 

Laser Wavelength               532nm

Engraving frequency            2 KHz

Pulse Width                      7ns

Single Point Power             1.2MJ

Quality of Laser Beam TEMoo、M2<1.5

Resolution                        500 Dpi

Engraving Dimension    190mm*160mm*100mm

Engraving speed   C2     2000 dots/second

Input Power Standard         220V/110V,50HZ

Power Consumption           0.6KW

Dimension of Mainframe    

C2:                     L760mm*W560mm*H560mm
Weight  C1/ C2:       65 KG