Product Description
Technical Specification
Minimum line width: 3. 5mil
Minimum line Spacing: 4mil
Minimum hole size: 0. 20mm
Minimum Annular Ring: 5mil
Max Copper thickness: 6OZ
Max production size: 600X800mm
Board Thickness: Double Sides 0. 2- 3. 0mm,
Multilayers: 0. 40-6. 0 mm
Min Solder Mask Bridge 0. 08mm
Pl ing Vias Capability: 0. 2-0. 8mm
Tolerance:
Plated holes Tolerance: 0. 05mm
Non-plated hole tolerance 0. 05mm
Outline Tolerance: 0. 10mm
Functional test:
Insulating resistance: 50 ohms( normality )
Peel off strength: 1. 4N/mm
Thermal Stress test: 288, 10 seconds
Solder mask hardness: 6H
E-Test voltage: 10V-250V
Warp and Twist: 0. 7%
Surface finishing:
OSP / immersion gold/flash gold/immersion silver / HAL
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