Product Description
- Power Module Material:Ceramic+FR4+Copper base Layer Coverage:4 Layers+Copper base Surface Technique:Immersion Gold Specialty:Ceramic+FR4 Multiply materials copper-clad laminate.
- O-E Module Material: Ceramic+FR4 Layer Coverage:6 Layers Thickness:1.0 mm Surface Technique:Gold-plate +finger Specialty:Embedded Orientation.
- Embedded Systems Material:FR4 Layer Coverage:8 Layers Thickness:1.6 mm Surface Technique:HAL Line Width/Space:4mils/4mils Solder Mask Colour:Yellow.
- DC/DC Power Module Material:Hi-Tg (170℃)、FR4 Layer Coverage:10 Layers Thickness:1.6 mm Surface Technique:Immersion Gold Specialty:Copper Weight 105 um Blind-via/Buried-via Larger Current .
- Telecommunication base-station Material:FR4 Layer Coverage:8 Layers Thickness:2.0 mm Surface Technique:HAL Line Width/Space:4mils/4mils Specialty:BGA、Impedance Control、Shade Solder.
- Data Collect Material:FR4 Layer Coverage:6 Layers Thickness:1.6 mm Surface:Electrolytic Au + Finger Au Weight Of Finger:30 Microinch Solder Mask Colour:blueBlind-via.
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