Product Description
| Panel Size X*Y(Max/Min) |
Max:457mmx610mm |
| |
Min:250mmx140mm |
| Cu. In Hole Wall |
8～38 um |
| Gold Thickness |
0.01-0.10 um |
| Hard Gold Thickness |
0.05-0.76 um |
| Min. Width and Min. Space |
0.075 mm /0.075 mm |
| Tolerance For Cover layer |
±0.15 mm |
| Min Solder Mask Bridge |
0.1mm |
| Silk To PAD Space |
0.2mm |
| Min. Test PAD |
0.2mm×0.2mm |
| ENEPIG |
≧0.08um |
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