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Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication 1
  • Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication 1

Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication

Model:3
Brand:-
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Circuit Board
Label:Micro PCB
Price: -
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Member Information

Detail

HX Circuit Technology Co.,Ltd.

Free MemberGuang Dong - China
Live Chat:
Last Online:26 Oct, 2018

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Product Description

Application Field: Communication
Layer/Board Thickness: 18L/1.5mm
Surface Treatment: ENIG
Line/Space: 4.0/4.0mil
Smallest Hole Diameter: 0.2mm
Technical Feature: impedance control


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Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication 1
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HX Circuit Technology Co.,Ltd.

7 floor, Huachuangda YiJing Building, Baoan 45 District, Shenzhen, China

Phone:
86-755-29446392
Fax:
86-755-29446393
Contact:
Annie Zhang (mamager)
Mobile:
29446392

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