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6A2 cup grinding wheel

Resin bond diamond wheels have the characteristics of good self-sharpness, sharp cutting, high grinding efficiency, low surface roughness, less heating, and not easy to burn the workpiece.

Resin bond diamond, it is suitable for high efficiency, precision grinding and polishing of most workpiece materials.

Main processing objects: used in LED industry sapphire epitaxial wafer, silicon wafer, GaAs Gallium oxide, gan wafer, glass and other industry products processing.

Workpiece material: artificial sapphire, monocrystalline silicon polysilicon, gallium arsenide and gallium nitride.

Through many years practice and research, our company has achieved great success in the field of resin bonded grinding wheel. Our craft if strict, the product performance is stable. It is widely used in rough grinding, semi-finishing, polishing, cutting and so on.

We provide all kinds of resin bonded diamond grinding wheels.

Diameter range: φ 6-900mm

grinding wheel thickness: 0.5-400mm

abrasive grain size: 30/ 35-w0.5

We can design and manufacture various non-standard products according to customer requirements.

Please contact us

Tel:+86 17796651219