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PUR electronic hot melt adhesive under heating molten state has a good stability and suitable viscosity operational equipment, have fast curing, excellent resistance to high and low moderate water resistance, easy to assemble, easy to repair.The adhesion of stainless steel, aluminum alloy, ceramics, plastic, glass, cable, non-woven fabric is good.Can be used for the window quickly assembled, cell phones, tablets, laptops, electronic products such as headphones, air conditioning display panel structure adhesive, and intelligent apparel products (hand ring, glasses, watches, pendants, etc.) the firmware and electronic product, etc.

TP assemble PUR hot melt adhesive

ST3541 electronic grade PUR hot melt adhesive

Single unit, medium and low viscosity, good fluidity and long opening time;

Moisture curing, initial adhesion, flexible and excellent, can quickly follow;

Black, with excellent adhesion to various plastics, can be used with glue machine, mainly for Windows rapid assembly;The borders of electronic products such as mobile phones and tablets are adhered to;Electronic product firmware assembly.

ST3542 electronic grade PUR hot melt adhesive

Single unit, medium and low viscosity, good fluidity and long opening time;

Moisture curing, initial adhesion, flexible and excellent, can quickly follow;

It has excellent adhesion to many kinds of plastic, and can be used with glue machine, mainly for quick assembly of Windows.The borders of electronic products such as mobile phones and tablets are adhered to;Electronic product firmware assembly.

ST3543 electronic grade PUR hot melt adhesive

Single unit, medium and high viscosity, good liquidity and short opening time;

Moisture curing, high initial adhesion, excellent flexibility, high temperature tolerance, water - boiling, quick follow up;

It has excellent adhesion to plastic and metal. It can be used with glue machine. It is mainly used for fast assembly of Windows.The borders of electronic products such as mobile phones and tablets are adhered to;Electronic product firmware assembly.

ST3544 electronic grade PUR hot melt adhesive

Single unit, medium viscosity, good fluidity and short opening time;

Moisture curing, high initial adhesion, excellent flexibility, high temperature tolerance, water - boiling, quick follow up;

It has excellent adhesion to glass and metal. It can be used with glue machine. It is mainly used for fast assembly of Windows.The borders of electronic products such as mobile phones and tablets are adhered to;Electronic product firmware assembly.

ST3548 electronic grade PUR hot melt adhesive

Single unit, medium viscosity, good liquidity, short opening time, good repair:

Moisture curing, high initial adhesion, excellent flexibility, high temperature tolerance, water - boiling, quick follow up;