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In2O3/SnO2 ITO target 1
  • In2O3/SnO2 ITO target 1

In2O3/SnO2 ITO target

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Brand:CAM
Origin:Made In China
Category:Chemicals / Coatings, Varnish & Painting
Label:ITO target Al/Nd CF , indium TN STN CSTN , ITO SIO2 TFT-LCD
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Product Description

Deposited by magnetron or other sputtering techniques, Indium Tin Oxide (ITO) target is used for the ITO coated substrates including electrodes for flat panel displays, touch panel contacts, energy saving automobile and building window glass, optoelectronic devices, solar panels, etc.

Specifications:Purity: 98%, 99%, 99.5%, 99.9%, Purity: 98%, 99%, 99.5%, 99.9%, 99.95%, 99.99%, 99.999%


1.) Oxide sputtering target:
CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, WO2.9, HfO2, MgO, Al2O3, Indium Tin Oxide, ITO (In2O3-SnO2), ZnO, Al2O3 doped ZnO (AZO), IZO (Indium Zinc Oxide, 90 wt% In2O3 / 10 wt% ZnO), Ga2O3 doped ZnO (GZO), IGZO, La0.67Sr0.33MnO3 (LSMO), ZrO2-Y2O3 stabilized (YSZ), SnO2, Sb2O3 doped SnO2 (ATO), ZrO2+Ti, ZrO2+Zr, ZrO2+SiO2, Bi2O3, Cr2O3, MoO, MoO3, NiO, SiO, Cr-SiO, SiO2, TiO, TiO2, TiO2-Nb2O5, Ti2O3, Ti3O5, CuO/Al2O3, Sb2O3, BaO, BaTiO3, CaO, Fe2O3, Fe3O4, PbO, PbTiO3, PbZrO3, LiNbO3, SrO, SrTiO3, SrZrO3, SrBaTiO3, PZT (Plumbum Zirconate Titanate), LaNiO3, InGaZnO, CuInO2, LaAl2O3.



2.) (Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide) sputtering target
LaB6, ZrB2, CrB2, TiB2, HfB2, Mo2B5, TaB2, NbB2, W2B, WB, VB2
TiC, SiC, WC, WC-Co, WC-Ni, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VC
Si3N4, AlN, BN, BN/SiC mixture, HfN, TaN, NbN, ZrN, TiN, VN
LaF3, CeF3, NdF3, YF3, NaF, KF, BaF2, AlF3, LiF, CaF2, SrF3, SrF2, MgF2
CoSi2, Mo5Si3, MoSi2, Ta5Si3, TaSi2, Nb5Si3, NbSi2, CrSi2, Cr3Si, HfSi2, TiSi2, Ti5Si3, ZrSi2, WSi2, VSi2, V3Si, NiSi,
CdS, ZnS, ZnS:Mn, In2S3, Sb2S3, PbS, MoS2, TaS2, WS2



3.) Metal sputtering target:
Silver, Ag, Iridium, Ir, Ruthenium, Ru, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y, Silicon, Si, Tellurium, Te, Bismuth, Bi, Tin, Sn, Zinc, Zn, Boron, B, Lead, Pb, Antimony, Sb, Chromium, Cr, Cobalt, Co, Aluminum, Al, Nickel, Ni, Titanium, Ti, Tungsten, W, Molybdenum, Mo, Tantalum, Ta, Niobium, Nb, Zirconium, Zr, Hafnium, Hf, Vanadium, V, Germanium, Ge, Indium In, Copper, Cu, Iron, Fe, Manganese, Mn, Magnesium, Mg.



4.) Alloy sputtering target:
Ag-Al, Ag-Cu, Ag-La, Ag-Lu, Ag-Mg, Al-Sm, Ag-Sn, Al-Ag, Al-Cr, Al-Cu, Al-Dy, Al-Er, Al-Gd, Al-Mg, Al-Mg-Si, Al-Sc, Al-Si, Al-Si-Cu, Al-Sm, Al-Ta, Al-Ti, Al-Mo, Al-Nd, Al-V, Al-Y, Al-Yb, Cd-Sn, Ce-Ag, Ce-Cu, Ce-Gd, Ce-Sm, Ce-Ti, Co-Al, Co-B, Co-Cr, Co-Cr-Al, Co-Cr-Fe, Co-Fe, Co-Fe-B, Co-Fe-Gd, Co-Gd, Co-Ni, Co-Ni-Cr, Co-Tb, Co-V, Co-Zr, Cr-Al, Cr-B, Cr-Cu, Cr-Mn, Cr-Ni, Cr-Si, Cr-V, Cu-Al, Cu-Ga, Cu-Ge, Cu-In, Cu-Ni, Cu-Zn, Dy-Fe, Dy-Co, Dy-Fe-Co, Fe-Al, Fe-B, Fe-Co, Fe-Gd, Fe-Hf, Fe-Mn, Fe-Ni, Fe-Si, Gd-Ce, Gd-Fe, Gd-Fe-Co, Gd-Er-Si, Gd-Tb, Gd-Ti, Ho-Cu, Hf-Fe, Hf-Y, In-Sb, In-Sn, In-Zn, LaB6, La-Al, La-Ni, Mg-Al, Mg-Ca, Mg-Dy, Mg-Gd, Mg-In, Mg-Nd, Mg-Nd-Zr-Y, Mg-Sc, Mg-Sm, Mg-Y, Mg-Zr, Mn-Fe, Mn-Ni, Mo-Cr, Mo-Si, Nb-Ti, Nd-Ag, Nd-Fe-B, Ni-Al, Ni-Cu, Ni-Cr, Ni-Cr-Al, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ni-V-Zr, NiYb, Ni2Yb, Ni3Yb, Ni-Yb, Ni-Zr, Sc-Ni, Sc-Zr, Sm-Co, Sm-Fe, Sm-Zr, Ta-Al, Ti-Al, Ti-Al-Cr, Ti-Al-Y, Ti-Al-V, Ti-Co, Ti-Cr, Ti-Ni, Ti-Si, TiSi2, Ti-Zr, Tb-Dy, Tb-Dy-Fe, Tb-Fe, Tb-Fe-Co, Tb-Gd-Fe-Co, V-Al, V-Co, V-Cr, V-Cu, V-Fe, V-Mo, V-Ni, V-Ti, V-Ti-Al, W-Ti, W-Si, Y-Ti, Y-Zr, Y-Zr-Mg, Zn-Al, Zr-Al, Zr-Ce, Zr-Cu, Zr-Gd, Zr-Si, Zr-Ti, Zr-Y


EVAPORATION MATERIALS
La2O3, CeO2, Pr6O11, Nd2O3, Sm2O3, Gd2O3, Dy2O3, Er2O3, Sm2O3, Yb2O3, Y2O3, LaF3, CeF3, PrF3, NdF3, SmF3, GdF3, DyF3, ErF3, YbF3, ScF3, YF3, HfO2, CaF2, ZnS, CdS, SiO2, HfO2, ZrO2, TiO2, TiO, Ti2O3, Ti3O5, Ta2O5, Nb2O5, SiO2, Al2O3, MgO, ZnO, WO3, Bi2O3, Sb2O3, Cr2O3, NiO, CuO, Fe2O3, V2O5, BaTiO3, SrTiO3, PrTiO3, LaTiO3, MgF2, BaF2, SrF3, CaF2, KF, NaF, ZnS, CdS, ZnSe.


Specification of materials (custom composition, drawing and size upon request):
1.) Foil, sheet, plate
Thickness: 0.05mm min.
Length: 1500mm max.
Width: 800mm max.

2.) Disc, wafer
Thickness: 0.05mm min.
Diameter: 600mm max.

3.) Powder
From -40, -60, -325, -325 to -1000 mesh

4.) Granule or pellet
Diameter:1mm-10mm

5.) Wire:
Diameter: 0.1mm min.
Length: according to customer's requirements.

6.) Rod
Diameter: 1.0mm-40mm
Length: 1500mm max.

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In2O3/SnO2 ITO target 1
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Cathay Advanced Materials Limited

B6208, Jinbao Chuangye Jiayuan, Zhongkai High Technology Development Zone, Guangdong, 516006, China.

Phone:
86-752-2627166
Fax:
86-752-2627926
Contact:
Kevin Mao (Sales Director)
Mobile:
+86 752 2627166

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