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Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.

     The most competitive 4 types:thin aluminum wire wedge bonder  MDB-2575(25-75um aluminum wire);Wire wedge bonderMDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for samll quantity production, school,institution,research department.

     And the 3 automatic:  automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonderMD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).

     Click here to view all product.

1: Thin wire bonder MDB-2575:

      Application:

Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg

2, Wire wedge bonder MDB-25125

   Application:

Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor etc.

Specification:

1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

2,wire diameter:25~125μm
3,ultrasonic power:0-5W, two channel. can be set separately of the two point

4,wire cutting:can set cut or no cut. 5,bond time:10-200ms,two channel 6,bond force:30-1000g,two channel

7, span between first bond to second bond by automatic mode:0-9mm(motorized) 8,bond radian: 0-6mm(motorized)
9, jig moving area: Φ16mm
10,mouse hand:20*20mm

11,digital camera: optional 12,dimension:600*560*390mm;weight:28kg 

3:Heavy wire bonder MDB-7550:

Application:

High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)
3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel
5,bond force:30-1200g,two channel
6,motorized Y:0-18mm
7,microscope rate:7.5 and 15
8,working area:Φ25mm
9,light:adjustable brightness
10,size:620×610×560mm
11,weight:~40kg 

4:Gold wire ball bonder MDBB-1750:

Application:

LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground

2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm

15,weight:28kg 

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Packaging & Shipping

ABOUT PACKAGING:

First we use foam and paper package,and second we use plywood box to cover, ensure there willl be no 

injury during delivery. as below:

ABOUT SHIPPING:

First, usually we quote an EXW price, the shipping method should be discussed. we have tried fast forward 

as DHL, and have tried by air, and by land to Russia, also by sea. also we are glad to support customer's own

forwarder.

company introduction

      Guangzhou Minder-Hightech Co.,Ltd(main web page: minder-hightech.en.alibaba.com/www.minder-hightech.com) is focused on connection(welding).

      We are comprised by a group of high educated specialists,with the leader of overseas professor, some of us have more than 20 years welding experience,our goal is to provide high performance product but low price and exceeded service.

      We care for the safety of operator, this year, we developed a safety system in spot welding industry named SOFT TOUCH system,which can prevent heavy pinch point injury.

      We are specialized in most of the connection(welding) technics,the most application we have participated in are electronic component(resistance,capacitor,inductor),chip on board,automotive electronic accessories,cell phone,IC cards,motor armature commutator etc.By material, we have engaged in connecting the Aluminum, Copper, Brass, Au(gold), Platinum, Nickel, Enameled wire, etc.

       We also provided the full IC package line; and LED producing line; Crystal oscillator producing line; as well as the wafer machining equipment.

       Our product are classified into resistance spot welding,inverter seam welding, ultrasonic wire bonding,hot bar soldering,automatic TIN soldering,stud welding, all the product are with mature latest technology,high performance,high precision,and high reliability.

       At the same time, we maintain a good relationship with the high school scientific research institution,we know the newest connection(welding) technology direction all over the world, committed to give out the best connection(welding) solution to our global customer.

       We chose the most open and industrialized city-guangzhou-to be our base head place,to ensure the efficiency and rapidly response.

       These years,we proud of our growth with the famous company such as TPT,K&S,ASM,Bosch,Miyachi,Uniteck,Avio,Apollo,LPKF etc.