Manufacture Intel 775/776 1.5U copper skived/extrused heat sink radiator
Product Description
| Application: |
1.5U Server&Up,workastion&Tower desktop solution,Power Supply,CPU/ Telecom, Wireless/Network,Security, Industrial, Power/Energy/Equipment |
| Socket Type: |
LGA 775 |
| Application platform: |
Pentium®D Pentium® 4 & Xeon® 3000 |
| Features: |
1. Pure Copper skiving crafts |
| 2. 50*50*4mm stairs can absorb thermal from CPU directly,and transmit it to heat sink. |
| 3. PWM function can extened the life of fan,fan combine with heat sink ,can make the disspation effect more better. |
| Mounting way: |
Screw+ Spring |
| Product Size: |
90*88*52mm |
| Weight: |
524g（Note：If Weight of Heat sink ≥500g，
Pls do not install in CPU in case of damage. |
| Thermally conductive material |
AD66（Thermally conductivity >4.0） |
| Back Plate: |
NA |
| Surface Finish: |
anodizing, electrophoresis, nickel plating, sandblasting, power plating, wire drawing, polishing, anti-oxidation coating, etc. |
| Process: |
extrusion, skiving fin, stamping, die casting, precision CNC
machining, drilling, milling, bending, soldering, etc |
| Packing: |
Retail packing |
| Factory: |
Yes |
| Payment Terms: | Western Union,Paypal |
| |
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