flip-chip bonding machinery
Product Description
Machine Structure:
1. Adhesive dispensing: it’s the same with RF1130, with fine adjustment in Z direction. Positioned by a CCD(CAM 1).
2. Chip picking and pasting: Picking operation is the same as RF-1130, with fine adjustment in X, Y, Z three directions, can be revote in 360 degree in Z direction and with buffer device. Another CCD here is for the chip positioning.
3. Thermode: Both head of top and base thermode can be heated. Power source and controlling system is same as RF-1130. The position can be adjusted within 100mm to suit for different width of antenna.
4. Antenna feeding: Automatically feeding by stepping motor, positioned by sensor and precise positioned by CCD(CAM 1).
5. Antenna fixing device: There are vacuum holes on the fixing plate, through CCD( CAM1) to position.
Scheme Draft
Product Image
Img 1
Send Inquiry to this Member
Related Products of this Company
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content.
To report fraudulent or illegal content, please
click here.
China Suppliers Quick Searching:
,
