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Specification
Applicable PCB Size:W50mm*D50mm ~ W430mm*D350mm
Applicable BGA Size: 7mmX7mm ~ 55mmX55mm
Max BGA Weight:80g
Upper heater(Hot Air):600W
Lower heater(Hot Air):800W
Bottom Preheat IR heater:2400W
Machine Dimension：650mm*500mm*600mm
Machine Weight：36KG
Power supply： AC 220V 4KW

Independent 3 Heater:

Upper/Lower hot air heating, Bottom IR preheating

1.The upper&lower heaters: BGA can be heated from upper and bottom at the same time. temperature accuracy within ±2℃,make BGA melt completely;

2.IR preheating area is adjustable according to desire requests, and matched with PCB clamps to make PCB heating evenly and protect motherboard from deformation during heating process;   

1.Adopt high definition human-machine interface, easy operation ;

2.Setup heating temperature curve and analysis it;

3.Real-time temperature curve can be displayed on operation interface;

4.Real-time monitor LEAD/LEAD FREE solder ball melt temperature change, adjust temperature curve and unlimited save temperature curve for later use;