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AlSi Alloy Electronic Packaging

General Description

　　Baienwei AlSi alloys include:Silicon content: 27%,42%,50%,60% and 70%, mainly used in electronic packaging field,playing outstanding performance in power electronic device package,
such as microwave high power devices,integrated circuit modules and T/R modules etc.As an electronic packaging material,AlSi alloy can be used in substrates,housings,carriers and lids, having a better compatibility and heat dissipation to prolong the working life of high power modules. AlSi alloys have the features such as light weight,(density 2.4—2.7g/cm³),high thermal conductivity,low CTE,high stiffness,excellent machinability,weldability,surface plating performance,hermeticity,high temperature resistance and corrosion resistance etc.

　　Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.

Commonly Used Packaging Materials Performance Comparison