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Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 1Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 2Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 3Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 4Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 5
  • Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 1
  • Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 2
  • Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 3
  • Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 4
  • Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 5

Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED

Model:JRFT-PM200S
Brand:JRFT
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:gap pad , thermal gap pad
Price: US $0.02 / pc
Min. Order:1 pc
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Member Information

Detail

Product Description

Thermal Silicone Gap Pad

1. Quick Details

Place of Orign: Guangdong, China       Brand Nane: JRFT         Thickness(mm): 0.25~5

Color: White                           Type: Insulation Film    Material: Thermal Interface Material

Application: High Temperature          Thermal Conductivity: 2.0W/m-k

Hardness(ShoreA): 25±5                Elongation: 60%

2. Applications

(1).Desktop, notebook and other portable computer

(2). Communication product, smart phone, tablet 

(3). Semiconductor and the radiating fin between

(4). Household appliances, LCD display

(5). LED lighting, lighting equipment

(6). Large power supply etc.

3. Performance

(1). Stable performance, low thermal resistance, effectively improve the heat transfer speed

(2). Low hardness, its viscosity high, easy to use 

(3). High thermal conductivity : 2.0W/m-k

(4). .By UL and V-O certification standards

4. Specification

Standard size : 300mm*300mm, 200mm*400mm, according to customer needs to cut the shapes.
Basic thickness : 0.3mm~5.0mm, special thickness, size can be customized
Its slightly viscous, if need to strengthen the adhesive can according to customer’s requirement.

Product color is mass production color, if need special color can be adjusted to the actual situation.
 

 


Product Image

Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 1
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Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 2
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Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 3
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Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 4
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Thermal Conductivity Thermal Insulation Silicone Gap Pad for CPU/LED 5
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Send Inquiry to this Member

Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

3/F, No.2 Bldg., Yinghe Industrial Park, Tongsheng Community, Dalang St., Longhua New District, Shenzhen, China

Phone:
86-755-29304991
Fax:
86-755-22140591
Contact:
Julie Chou (Foreign Trade Clerk)
Mobile:
18270828627

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