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Capability:
Layer Count: 2-30 Layers
Products Type:
HF (High Frequency) & RF (Radio Frequency) board, Impedance controlled board ,
HDI board, BGA & Fine Pitch board, Heavy Copper board ( up to 7 OZ)
 
Material:
Laminate:  FR4 (SHENGYI  S1141)
HF material:  Rogers, Taconic, Arlon
High TG material:  SHENGYI / S1170, ITEQ / IT180 and related PP
Halogen Free material:  SHENGYI / S1155 / S1165
Solder Mask:  Taiyo PSR 2000/4000
Plating Chemistry:  ROHM & HASS
 
Surface Finish:
Leaded HAL, Lead free HAL, ENIG, OSP (Entek), Immersion Tin,
Immersion Silver, Hard Gold(50u")
 
Selective Surface Treatment:
ENIG + OSP, ENIG + Gold Fingers, Immersion Silver + Gold Fingers,
Immersion Tin + Gold Fingers
 
Technical Specification
Min. Trace Width/Space: 3/3mil (outer layer, finished copper 30um), 2.5/2.5mil(inner layer, 1/3 or 1/2 OZ)
Min. Hole Size: 0.15mm/6mil (mechanical drill), 0.1mm/4mil (laser drill)
Min. Annular Ring: 4mil
Min. Distance Between Layers: 2mil
Max. Finished Copper Thickness: 7 OZ
Max. Finished Board Size: 600X800mm / 23.5"*32.5"
Finished Board Thickness:  Double Sided: 0.2-7.0mm / 0.008"-0.28", Multilayer: 0.40-7.0 mm / 0.016"-0.28",
Min. Solder Mask Bridge: ≥0.08mm
Aspect ratio: 16:1
Pl ing Vias Capability: 0.2-0.8mm
 
Tolerance :
Plated holes Tolerance: ±0.075mm （min.±0.05）
Non-plated hole tolerance: ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.1mm(mils±0.05-0.075mm)