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Item specifics

Model Number:

702-0000218

Brand Name:

SIREDA

is_customized:

Yes

Package:

BGA

Pitch:

1.0mm

Pin Count:

153

IC Size:

Structure:

Contact:

Spring Probe

Product Description

The F solution   designed for test, debug, and validation of devices of BGA,  LGA, QFP, QFN, SOP, etc. For devices with more than 256 pins, please look for our “U” solution.  

• Test, debug, validation of devices of BGA,LGA,QFP,QFN,SOP,etc
• Pitch from 0.4mm to 1.27mm
• "Buy and use" modular design
• Standardized design shorten lead time

• F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 
• The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board costs.
• Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime.
• Fully removable double latch turning lid makes it can be used for both manual and automatic operation, and enable quick device insertion and extraction.
• Avoid problem of pad co-planarity, oxidation and damage of PC board after de-soldering comparing to conventional design, Provide protection to PC board from cutting through by probes.
• "Buy and use" modular design makes it no needs customer to provide PC board, protect customer's IP.
• Standaridized design simplify processing,save cost and shorten lead time. 3 ~ 4 days since PO received to product delivery.

Packaging Details

Unit Type:

piece

Package Weight:

0.500kg (1.10lb.)

Package Size:

12cm x 11cm x 9cm (4.72in x 4.33in x 3.54in)