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Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  1Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  2Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  3Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  4Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  5
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  1
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  2
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module  3
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Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module

Model:PM 300
Brand:Karefonte
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:Gap Filler Pad , Thermal Gap Filler , Gap Pad For LED CPU
Price: US $0.003 / pc
Min. Order:10 pc
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Member Information

Detail

Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.

Biz MemberGuang Dong - China
Live Chat:
点击这里给我发消息Last Online:09 Jan, 2023

Product Description

Applications: 
1.Car engine module, notebook computer 
2.Flat panel TV, mobile equipment, high-speed hard disk drive 
3.Between semiconductor and radiating fin 
4.Desktop, portable computer and server 
5.LED lighting device, the power supply of UPS 
6.LED and PDP flat panel display 


Performance: 
◆High thermal conductivity:3.2W/m-k 
◆Stable Performance, low thermal resistance, effectively improve the heat transfer speed 
◆Low hardness, its viscosity high, easy to use 


Specification: 
◆Standard size:310mm*310mm, 200mm*400mm according to customer needs cut the shape 
◆Basic thickness:0.25mm*5.0mm, special size and thickness can be customized 
◆Its slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement 
◆Product color is mass production color, need special color can be adjusted according to the actual situation 

PM300 thermal pad combine high thermal conductivity with compliance perfect, can fill the gaps, improve heating parts and the radiating part of the heat transfer capacity. These soft interface material can make the minimum pressure and the surface to combine , resulting in little or no stress on mating parts. Taking advantage of silicone soft  and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module effectively transfer the heat to the radiating component. 


Price Terms:FOB/CIF
Payment Terms:TT / Western Union / Paypal / MoneyGram
Packing:box
Lead Time:After Payment 1-3 working days
Standards Certificate:ISO 9001 , RoHS , REACH
Color:Grey / Blue / Black
Size:200mm*400mm 310mm*310mm (customized)

Product Image

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Send Inquiry to this Member

Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.

3/F, No.2 Bldg.,Yinghe Industrial Park,TongSheng Community,Dalang St.,Longhua New District,Shenzhen,China.

Phone:
+86-755-29304991
Fax:
+86-755-22140591
Contact:
Besy (Sales Manager)
Mobile:
15920076603

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