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 Interface Materials Thermal Phase Change For Memory/Power Module 1 Interface Materials Thermal Phase Change For Memory/Power Module 2 Interface Materials Thermal Phase Change For Memory/Power Module 3 Interface Materials Thermal Phase Change For Memory/Power Module 4 Interface Materials Thermal Phase Change For Memory/Power Module 5
  •  Interface Materials Thermal Phase Change For Memory/Power Module 1
  •  Interface Materials Thermal Phase Change For Memory/Power Module 2
  •  Interface Materials Thermal Phase Change For Memory/Power Module 3
  •  Interface Materials Thermal Phase Change For Memory/Power Module 4
  •  Interface Materials Thermal Phase Change For Memory/Power Module 5

Interface Materials Thermal Phase Change For Memory/Power Module

Model:PC210
Brand:Karefonte
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:Phase Change , Interface Materials , Thermal Phase Change
Price: -
Min. Order:50 pc
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Member Information

Detail

Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.

Biz MemberGuang Dong - China
Live Chat: Chat Now
点击这里给我发消息Last Online:25 Aug, 2022

Product Description

Product introduction

The phase change characteristics : material is solid at room temperature and is convenient to install, used between the heat sink and device. When they reach the product phase change temperature materials become soft, flowing, filled into the device small irregular contact surface. So completely have the ability to fill the gaps between the interface of the air gap and the device and heat sink, the phase change pad is better than that of non flow elastomer or graphite based thermal pad, and has the properties of thermal grease.

This material is heat reinforced polymer, to meet the thermal conductive of high terminal heat conduction application , reliability demand. Combined with the thermal resistance small channel so that the performance of the heat sink to achieve the best. Improve the micro processor, memory module DC - DC converter and the reliability of the power module.

   Application :

   ◆High frequency microprocessor, chipset, graphics processing chips /power AMP chip, cache memory chip,         customer homemade .

   ◆DC--DC converter, memory module, power module, memory module, solid state relay, bridge rectifier

   Advantage :

   ◆Low thermal resistance under low pressure

   ◆Inherent viscosity, easy to use and not need to use the adhesive

   ◆No need preheating the radiator

   ◆Flow but not silicone oil

   ◆Low volatility -- less than 1%

 


Price Terms:FOB/CIF
Payment Terms:TT/ Western Union / Paypal / Moneygram
Packing:box
Lead Time:after payment 1-3 working days
Standards Certificate:ISO 9001, RoHS, REACH
Color:Grey / Black / Pink /Yellow
Size:customized

Product Image

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 Interface Materials Thermal Phase Change For Memory/Power Module 2
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 Interface Materials Thermal Phase Change For Memory/Power Module 3
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 Interface Materials Thermal Phase Change For Memory/Power Module 4
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Send Inquiry to this Member

Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.

3/F, No.2 Bldg.,Yinghe Industrial Park,TongSheng Community,Dalang St.,Longhua New District,Shenzhen,China.

Phone:
+86-755-29304991
Fax:
+86-755-22140591
Contact:
Besy (Sales Manager)
Mobile:
15920076603

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