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FOG/FOB bonding machine equipmentXCM71-A6

1、The definition of FOG/FOB bonding machine equipment XCM71-A6:
FOG/FOB bonding machine equipment  referred to as "state machine equipment" "hot press," using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached  a  ACF. use  head pressure,  head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF  glue which is  between the PCB so that it can   conduct. 

2、 About the application field of  FOG/FOB bonding machine equipment XCM71 -  A6
FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises. 
3、About the working principle of FOG/FOB bonding machine equipment XCM71 - A6
Working principle of FOG / FOB bonding equipment XCM71-A5 is to using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached  a  ACF. use  head pressure,  head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF  glue which is  between the PCB so that it can   conduct. 
4、 About the FOG/FOB bonding machine equipment XCM71  -  A6's competitive advantage 
6.1  Patent  of sunsom(Patent No. ZL 201120120232.2): SUNSOM pressure system cylinder head structure can eliminate dead weight, pressure, minimum accuracy up to 0.1KG 
6.2 Pressure head downward structure part USES the level 3 circuit control, according to quantitative production, manual production, production deb ing needs to choose different control methods, has solved the past  problem due to the different work mode press head downward inconvenience control .
6.3 Stepper, servo memory function and Automatically position the same amount of production equipment’s function used on the equipment subtly on the device solves any inconvenience  caused by  the big flat repeatedly move.
6.4 Own the qualification of equipment manufacturing enterprise in china which has a maximum size of flat panel display of FPD 
5、About the basic parameters of FOG/FOB bonding machine equipment XCM71 -A6
Input Power: AC220V 50-60Hz 
Working pressure :0.4-0 .8 Mpa 
Operating modes: 7-inch HMI 
Dimensions: L2210 × W1730 × H1500 mm 
The method of Heating: heating or pulse heating thermostat 
The quantity of Fixture: 2 group X-Y-θ micrometer adjustable 
Range of Temperature : RT-500
Control program: PLC controller 
Body main material: Steel + baking varnish
The thermocouple: K type