Product Description
- Base materials: FR4, aluminum, FPC and copper
- Minimum copper thickness: 0.5oz
- Maximum copper thickness: 4oz
- Minimum board thickness: 0.2mm
- Maximum board thickness: 3.2mm
- Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
- Possible solder mask colors: green, black, white, yellow, blue, red and more
- Board dimensions: 600 x 1,000mm
- Minimum hole diameter: 0.2mm
- Minimum line width: 0.075mm
- Minimum line spacing: 0.075mm
- Minimum SMT pitch: 30°
- Minimum annular ring: 0.05mm
- Aspect ratio: 11:01
- Surface/hole plating tolerance:
- Hole tolerance (PTH): 0.25mm
- Hole tolerance (NPTH): 0.15mm
- Electrically test: yes
- With RoHS Directive-compliant
- Possibility of SMT device mounting: yes
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