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Polyamide consisting of a polyamide film and silicone
adhesive designed for high temperature masking
applications, including the protection of gold edge fingers
and edge connectors during wave soldering and reflow
soldering processes within the PCB assembly industry. It is
used in electrical insulation application meeting class H
requirements.
Main features:
. Thin and conformable enabling masking of uneven surfaces.
. Wide operating temperature range up to 500°F.
. Excellent electrical insulation
. Remove clearly without adhesive residue after exposure to
heat/chemical
. Masking for protection of gold fingers and edge
connectors during wave soldering and reflow soldering
processes or solder dip process within the PCB assembly
industry.
. Release surface in fabrication of parts cured at elevated
temperatures.
. Widely used for electrical insulation on transformer,
motor, coil, PCB masking and so on.