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1、The definition of Upper and lower pulse hot press machine XCM53-A2 :
Upper and lower pulse pressing machine (double the pressure) referred to as "hot-press", "bonding machines" ,it use heat pipe and pulsed to heat , mainly applicable to bonding capacitive touch screen (CTP), LCD module production and maintenance processes after attached FPC, COF, TAB  LCD and PCB well with ACF. using  the pressure, temperature, bonding time, optical alignment system of indenter to make glue of  LCD、FPC、ACF、PCB fixed so that it can conduct.

2、The alternative name of Upper and lower pulse hot press machine XCM53-A2
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3、About the classification of Upper and lower pulse hot press machine XCM53-A2 
1, Classified according to function
1.1 heating by Constant temperature 
1.2 heating by Pulse
2,Classified according to degree of automation
2.1 Semi-FOG Bonding  
2.2 Automatic FOG bonding equipment
3,Classified according to the work way of the stage
3.1 preload 
3.2 Pressure 
3.3 preload and Pressure
4.Classified according to work way: 
4.1 single head, in and out of work with simplex platform 
4.2 single head, fixed work with simplex platform
5, Classified according to bit mode: 
5.1  the CCD up alignment 
5.2  the CCD down alignment

4,About the application field of  Upper and lower pulse hot press machine XCM53-A2 
Upper and lower pulse hot  press machine XCM53-A2 (double-sided the pressure) is widely used   in various capacitive touch screen (CTP), the liquid crystal display panel, and medium and small-sized production and assembly maintenance; such as: mobile phones, televisions (TV), laptop computers (NOTEBOOK), liquid crystal display (MONITOR), tablet PC (PAD), LCD / LCM production enterprises.
Production for mobile phones.

5,About the working principle of Upper and lower pulse hot press machine XCM53-A2
Upper and lower Pulse Hot press Machine (The double-sided pressure) working principle is to use head pressure, pressure head temperature, bonding time, optical alignment system ACF bonding glue FPC, COF and the LCD and PCB board ,so that it can conduct electricity.

6,About the Upper and lower pulse hot press machine XCM53-A2's competitive advantage
6.1SUNSOM patent (Patent No. ZL201120120232.2): SUNSOM cylinder structure pressure system can eliminate weight of head, accurate pressure . 
6.2 adopt Japanese temperature controller and built-in PID temperature self-tuning function module, the precision temperature .

7,About the basic parameters of Upper and lower pulse hot press machine XCM53-A2
Input Power: AC220V 50-60Hz 
Operating modes: 7-inch HMI 
Rated Power :5-6KW 
Vacuum Processing: Built-vacuum 
Working pressure :0.4-0 .8 Mpa 
Pneumatic components: Japan SMC 
For size: 7 inches (selected) 
Pressure setting: SMC Precision Regulator 
Work: fixed stage 
Program control: PLC controller 
Storage Parameters: 500 groups 
Automatic elimination: twin eliminate weight

8,About the functions and characteristics of the Upper and lower pulse hot press machine XCM53-A2
8.1 SUNSOM patent (Patent No. ZL201120120232.2): SUNSOM cylinder structure pressure system can eliminate weight of head, accurate pressure .8.2 the temperature of upper and lower pulse heating curve is the same as digital temperature display.
8.3 three groups upper and lower Automatic roll the skin structure.
8.4 can store 500 groups of function parameters. 
8.5 pulse source output parameters can be adjusted according to the power head.