Product Description
Flex PCB Process Capability
Items:General Process Capability
Product type:Single Side,Double Side ,Hollow board,Multilayer FPC,Rigid-flex board
Layers:1---6 layers
Finished Board Thickness:0.05mm---2.0mm
Min. hole diameter:0.2mm(CNC)(8mil)
Min laser hole diameter:0.1mm
Min trace width and Space:1/3 OZ,1/2 OZ,1 OZ,2OZ
Min certer distance in contigeous finger:0.10mm
Surface Treatment :Plated Tin,Plated Ni/gold,ENIG,OSP
Material:PI\FR4
Reinforce Material:PI, FR4 steel 3M adhensive , PET
1.low price with high quality
2.Good service with fast delivery time
3.No MOQ,warm welcome prototype orders in any quantity as well as trial orders and initial orders.
4.engineering cost &stencil cost are charged once
5. offer a better quotation in short time.
| Payment Terms: | TT/DP/DA/PAYPAL/WESTERN UNION |
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