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Material
 
Sandwich structure, which includes layers of conductor, insulator and met High thermal conductive AL base CCL al base (Aluminum Based). 
 

Standard Size (mm)
 
500×610mm,550×610mm,550×1220mm,550×1220mm,1000×1220mm,1100×1220mm
 

Circuit Layer(copper foil )
 
18μm,35μm,70μm,105μm(Hoz,1oz,2oz, 3oz)
 

Thermal Dielectric Layer Thickness
 
75μm,100μm,125μm,150μm,(3mil,4mil,5mil,6mil)
 

Thickness
 
0.8mm,1.0mm,1.2mm,1.5mm,1.5mm,2.0mm
 

Aluminum Substrate Type
 
1100,1060,3003,5052,6061 Anodization
 

Masking Film
 
PE,PET,PI
 

Using scope
 
 LED lighting, public lighting, Backlight module, outdoor LED display , Industrial electronics
 

~AL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR-4, PCB produced by the subtract can transfer heat, which is electronic components generate, throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification.