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BGA Rework Station ZM-R6200

Features:

1、 There are 3 independent heating areas. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating.

2、 Available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time.

3、 With large IR bottom heating, it can completely avoid PCB deformation during reworking period,

4、 can use software to choose freely or use top heater or bottom heater departly, and combine freely with top and bottom heater’s capacity,to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc.

5、 With optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within±0.01mm, adopted 12” HD monitor.

6、 With touch screen interface, k-type thermocouple, close-loop control.

7、 After finishing desoldering & soldering, There is an alarming and alarming in advance.

8、 CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens；with a double overheating protection control.

9、 CCD vision system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.(Optional)

Specifications and technical parameters:

1 Power supply:        AC 220V±10％  50/60 Hz
2 Total Power：Max 5300W
3 Heater: Top heater power:1200W     Bottom heater power: 1200W

        IR heater power: 2700W

4 Electrical selection:Highly sensitive temperature control module
5 Temperature control: (K Sensor) closed loop, independent heating, precision within ±3℃
6 Positioning: V type groove, with universal fixture
7 PCB size: Max 410×370 mm           Min 65×65 mm
8 Available BGA chip: Max 80×80mm              Min 2×2 mm
9 Dimensions: L640×W630×H900 mm
9 External temperature: 1 piece
10 Net weight: 70Kg
11 Color: White