Product Description
Products Information
This wafer baking machine is used for the mass production of wafer pieces, having 27~85 sets of templates.
Making mixture and baking process can be done automatically.
Technology and function
• The baking machine has double-oven structure, making the heating effect in inner oven better and the working life of mechanical parts in external oven longer.
• The control parts adopt color touch screen made by Mitsubishi or Siemens, which can display and set the running speed and temperature of baking sheet,
and control each mechanical parts, mixture volume and fire lighting.
• The gas system parts are international brand products. All bearings of the machine are German SKF high temperature ones
and all motors and speed reducers are German SEW.
• The baking sheet is made of grey cast iron, having longer working life, best use of thermal energy and even wafer pieces color.
• Built-in biscuit waste cleaning device.
• The thickness range of wafer pieces: 2.0mm~3.2mm
• The adjusting temperature range of baking sheet: Normal temperature to 180°C.
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